Internal stress induced during curing process of adhesively bonded parts of resin and metal
Nakamura Hirohumi; Sato Chiaki; Ikegami Kozo
Abstract:Internal stress induced during curing process is investigated analytically and experimentally for the adhesively bonded parts of epoxy resin and aluminum alloy. As the parts, two types are considered: two layered model, which has a molded resin layer on metal surface, and adhesive model, which has two metal plates bonded with resin. The viscoelastic properties of the resin during curing process are experimentally examined. The constitutive relations for the resin are formulated on the basis of the experimental results by using viscoelastic models. The internal stress induced during curing process is analyzed by using the finite element method. The stress distributions are obtained at the adhering interfaces of the two models. It is shown that the stress is remarkably concentrated at the adhering edge for both models. The method of laser Raman scattering is applied to measure the distribution of the internal stress near the adhering edges. The stress is measured by the method at short intervals along adhering interface from the adhering edge. It is confirmed that the stress singularity exists near the adhering edges. Key Words:internal stress, adhesive bonding, epoxy resin, curing process, raman scattering