Measurement of the strength of micro bonded parts by a new testing machine of micro combined loads
Iwata Hideo; Sato Chiaki; Ikegami Kozo
Abstract:This paper presents the strength of micro bonding with adhesive resin and solder under combined loads. The combined loading tests of micro butt joints between steel and piano wire bonded with resin or solder were carried out using a new testing machine of micro combined loads. The machine is available to measure the strength of micro bonded parts under combined loads. In case of micro bonded parts, the torsional failure stress of the specimen is stronger than the tensile stress. For adhesive bonding the tensile failure stress of the specimen as well as the torsional failure stress decreased with increasing the bonded area. For solder bonding, the tensile failure stress decreased with increasing the bonded area. But the torsional failure stress was not dependent on the bonded area in the experiments. Key Words:combined load, micro bonding, adhesive resin, solder, testing machine, bonded area