Monitoring of Micro Drilling of Printed Wiring Boards by Thermograph -Drilling Temperature of Printed Wiring Boards Reinforced by Aramid Fiber-
Toshiki HIROGAKI, Eiichi AOYAMA, Tsutao KATAYAMA, NAKAGAWA Heisaburo, Takahide NAKAMURA, Youhei SIMOKAWA and Hisahiro INOUE
Abstract:In the current manufacture of multi-layer printed wiring boards, AFRP (Aramid Fiber Reinforced Plastices) has been attracted attention, because of its low coefficient of linear thermal expansion in the x-y plane and of good machinability of CO2 laser. However, there are few reports dealing with drilling of AFRP printed wiring boards. Therefore, this paper describes the small diameter drilling of AFRP printed wiring boards. First, the temperature of drill tools was monitored by infrared thermography. Second, the drilled hole walls were observed by SEM and optical microscope. Comparing with them, it is clear that the drilled hole quality depend on the drill tool temperature in drilling . Additionally, it is confirmed that the increase of drill temperature is due to the heat caused by friction between the drill tool and drilled hole wall. Key Words:AFRP, Printed wiring boards, Micro Drilling, Thermography, Temperature, Hole quality