Lead-Free Bonding Proess Using Ag Nanoparticles for High Temperature Packaging
Eiichi IDE, Akio HIROSE and Kojiro F. KOBAYASHI
Abstract:We have proposed a novel bonding process using Ag metallo-organic nanoparticles with average particle size of around 11 nm, which can be alternative to lead-rich high melting point solders. The influences of bonding parameters on the bondability of Cu-to-Cu joints were examined based on the measurement of the shear strength of the joints and the observation of fracture surfaces and cross-sectional microstructures. The joints using Ag metallo-organic nanoparticles had strength ranging from 10MPa to 50MPa depending on bonding conditions. From the results, the bonding conditions providing the joint strength equivalent to those using the lead-rich high melting point solders were proposed. Key Words:Nanoparticle, Bonding to Cu, Lead-free high melting point solder, Sintering, Shear strength