Effect of Grain Size on Fatigue Behavior of Pure Copper and Cu-Al Alloys
Yoshito NISHIMURA, Nagato ONO and Sei MIURA
Abstract:In order to clarify the grain size dependence on the fatigue behavior of polycrystalline metals including twins from the view point of dislocation theory, pure copper, Cu-3.5at%Al, Cu-6.8at%Al and Cu-14.8at%Al alloys having the average grain sizes ranging from 9 to 122μm were prepared by a strain-annealing method. Fatigue tests at room temperature for each specimen were performed under the constant stress amplitude over a life range of 104 to 107 cycles. The fatigue properties at elevated temperatures for Cu-14.8at%Al alloys were confirmed up to 773K, and also the distribution of dislocations close to fatigue cracks was observed by using the etch pit technique. The grain size dependence on the fatigue strength for pure copper and Cu-3.5at%Al alloys disappears beyond 106 cycles, whereas the fatigue lives of Cu-6.8at%Al and Cu-14.8at%Al alloys uniformly increase with grain refining over all ranges. Relationship between the fatigue strength at 107 cycles and aluminum concentration for Cu-Al alloys of fcc solid solution can be approximately represented by a straight line as well as the shear stress. The fatigue strength of Cu-14.8at%Al alloys markedly decreases with increasing temperature and becomes almost half of that for room temperature at 773K. The results based on the etch pit observation indicate that the dislocations multiplied under cyclic loading pile up against the grain and twin boundaries, where large cracks along both boundaries form and propagate due to the stress concentration. Key Words:Pure copper, Cu-Al alloys, Fatigue strength, Grain size dependence, Twin boundary, Etch pit observation, Fatigue crack, Dislocation theory