International Standardization of Micro-Materials Evaluation Methods for MEMS Devices
Yakichi HIGO
Vol. 58 No. 10 CONTENTS
Special Issue on Micromaterials
General Paper
Special Issue on Micromaterials (Vol.58 No.10)
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Foreword | |
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Y.Higo |
803 |
Review paper (Vol.58 No.10)
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International Standardization of Micro-Materials Evaluation Methods for MEMS Devices |
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Yakichi HIGO |
804 |
Original Paper (Vol.58 No.10)
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Detection of Defects in Printed Wire by High-Temperature Superconductor SQUID Microscope |
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Daiki SHIOZAWA, Takashi FUJIMOTO, Naoki ARINO and Yoshikazu NAKAI |
808 |
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A Proposition on Material Properties Estimation of Piezoelectric Thin Films Utilizing Dual-Points Concurrent Displacement Measurement |
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Yasutomo UETSUJI，Ryota OGAWA，Hiroyuki KURAMAE and Kazuyoshi TSUCHIYA |
815 |
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Combinatorial Deposition Using Single Arc Plasma Gun |
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Seiichi HATA, Toshimitu FUJITA, Junpei SAKURAI and Akira SHIMOKOHBE |
821 |
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Effect of Copper-Tin Intermetallic Compound on Reliability of Fine Bump Joint Structures |
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Seongchoel JEONG, Naokazu MURATA, Yuki SATO, Ken SUZUKI and Hideo MIURA |
827 |
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Evaluations of Mechanical Properties of DLC Film by Indentation Method and the Effect of Substrate |
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Tomoyuki NAKAYAMA, Kenichi SAKAUE, Takeshi OGAWA, Yoshifumi KOBAYASHI and Takema TERATANI |
833 |
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Orientation Dependence of Fatigue Fracture Behavior in Pure Titanium Single Crystals |
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Masayuki TSUSHIDA, Takahiro SAKAMOTO, Hiromoto KITAHARA and Shinji ANDO |
841 |
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Evaluation of Mechanical and Electrical Properties of Very-Thin Pt Wires by Utilizing Joining Technique with Joule Heating |
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Hironori TOHMYOH, Hironao TAKEDA and Md. Abdus Salam AKANDA |
847 |
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Fatigue Crack Propagation of P/M Soft Magnetic Materials with a High-Resistance Surface Layer |
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Ryota TANEGASHIMA, Tetsuya SHIROSAKA, Hiroyuki AKEBONO, Masahiko KATO, Atsushi SUGETA and Kohji MINOSHIMA |
853 |
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Effect of Humidity on Fatigue Strength of Notched Age-Hardened Al Alloy |
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Norio KAWAGOISHI, Tomonori KANEMARU, Koji KARIYA and Yoshihisa OHZONO |
860 |
Translated Paper (Vol.58 No.10)
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Hall-Petch Relation and Twin Boundaries in Pure Copper and Cu-Al Alloys English version of the paper published in “Journal of the Society of Materials Science, Japan, 57(9):921-928(2008)” |
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Sei MIURA, Nagato ONO and Yoshito NISHIMURA |
865 |
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Development of Materials Evaluation by Diffraction Method Ⅰ.Residual Stress of Weld Section and X-Ray Residual Stress Measurement |
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Takayuki Kurimura and Yoshiaki AKINIWA |
873 |